Applications Requiring Substrate, Wafer and Die Thinning:
During ESD controlled proprietary thinning processes, the substrate edges, device topography and protrusions are protected. Depending on customer requirements, substrate, wafer and die thinning may involve:
Please call or e-mail for a quotation to meet your specifications.
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Aluminum Nitride Ceramic Substrates Precision Machining Silicon Carbide Technical Ceramics
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Updated: 3 June 2008 |
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